光器件封装详解------------------------------------------作者xxxx------------------------------------------日期xxxx【精品文档】【精品文档】产品名称无产品版本共28页无有源光器件的结构和封装分析：日期：拟制：日期：审核：日期：批准：日期：【精品文档】【精品文档】目录1有源光器件的分类....................................................................................................................62有源光器件的封装结构.............................................................................................................6光发送器件的封装结构.............................................................................................................7同轴型光发送器件的封装结构............................................................................................8蝶形光发送器件的封装结构................................................................................................8光接收器件的封装结构.............................................................................................................9同轴型光接收器件的封装结构............................................................................................9蝶形光接收器件的封装结构..............................................................................................10光收发一体模块的封装结构....................................................................................................101×9和2×9大封装光收发一体模块.....................................................................................10GBIC（GigabitInterfaceConverter）光收发一体模块....................................................11SFF（SmallFormFactor）小封装光收发一体模块.........................................................12SFP（SmallFormFactorPluggable）小型可插拔式光收发一体模块.............................13光收发模块的子部件.........................................................................................................133有源光器件的外壳..................................................................................................................15机械及环境保护......................................................................................................................15热传递.....................................................................................................................................15电通路.....................................................................................................................................16玻璃密封引脚....................................................................................................................16单层陶瓷...........................................................................................................................16多层陶瓷...........................................................................................................................17同轴连接器.......................................................................................................................17光通路.....................................................................................................................................18几种封装外壳的制作工艺和电特性实例..................................................................................19小型双列直插封装（MiniDIL）...............................................
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