半导体一些术语的中英文对照离子注入机ionimplanterLSS理论LindhandScharffandSchiotttheory又称“林汉德-斯卡夫-斯高特理论”。沟道效应channelingeffect射程分布rangedistribution深度分布depthdistribution投影射程projectedrange阻止距离stoppingdistance阻止本领stoppingpower标准阻止截面standardstoppingcrosssection退火annealing激活能activationenergy等温退火isothermalannealing激光退火laserannealing应力感生缺陷stress-induceddefect择优取向preferredorientation制版工艺mask-makingtechnology图形畸变patterndistortion初缩firstminification精缩finalminification母版mastermask铬版chromiumplate干版dryplate乳胶版emulsionplate透明版see-throughplate高分辨率版highresolutionplate,HRP超微粒干版plateforultra-microminiaturization掩模mask掩模对准maskalignment对准精度alignmentprecision光刻胶photoresist又称“光致抗蚀剂”。负性光刻胶negativephotoresist正性光刻胶positivephotoresist无机光刻胶inorganicresist多层光刻胶multilevelresist电子束光刻胶electronbeamresistX射线光刻胶X-rayresist刷洗scrubbing甩胶spinning涂胶photoresistcoating后烘postbaking光刻photolithographyX射线光刻X-raylithography电子束光刻electronbeamlithography离子束光刻ionbeamlithography深紫外光刻deep-UVlithography光刻机maskaligner投影光刻机projectionmaskaligner曝光exposure接触式曝光法contactexposuremethod接近式曝光法proximityexposuremethod光学投影曝光法opticalprojectionexposuremethod电子束曝光系统electronbeamexposuresystem分步重复系统step-and-repeatsystem显影development线宽linewidth去胶strippingofphotoresist氧化去胶removingofphotoresistbyoxidation等离子［体］去胶removingofphotoresistbyplasma刻蚀etching干法刻蚀dryetching反应离子刻蚀reactiveionetching,RIE各向同性刻蚀isotropicetching各向异性刻蚀anisotropicetching反应溅射刻蚀reactivesputteretching离子铣ionbeammilling又称“离子磨削”。等离子［体］刻蚀plasmaetching钻蚀undercutting剥离技术lift-offtechnology又称“浮脱工艺”。终点监测endpointmonitoring金属化metallization互连interconnection多层金属化multilevelmetallization电迁徙electromigration回流reflow磷硅玻璃phosphorosilicateglass硼磷硅玻璃boron-phosphorosilicateglass钝化工艺passivationtechnology多层介质钝化multilayerdielectricpassivation划片scribing电子束切片electronbeamslicing烧结sintering印压indentation热压焊thermocompressionbonding热超声焊thermosonicbonding冷焊coldwelding点焊spotwelding球焊ballbonding楔焊wedgebonding内引线焊接innerleadbonding外引线焊接outerleadbonding梁式引线beamlead装架工艺mountingtechnology附着adhesion封装packaging金属封装metallicpackaging陶瓷封装ceramicpackaging扁平封装flatpackaging塑封plasticpackage玻璃封装glasspackaging微封装micropackaging又称“微组装”。管壳package管芯die引线键合leadbonding引线框式键合leadframebonding带式自动键合tapeautomatedbonding,TAB激光键合laserbonding超声键合ultrasonicbonding红外键合infraredbonding微电子辞典Abruptjunction突变结Acceleratedtesting加速实验Acceptor受主Acceptoratom受主原子Accumulation积累、堆积Accumulatingcontact积累接触Accumulationregion积累区Accumulationlayer积累层Activeregion有源区Activecomponent有源元Activedevice有源器件Activation激活Activationenergy激活能Activeregion有源（放大）区Admittance导纳Allowedband允带Alloy-junctiondevice合金结器件Aluminum(Aluminium)铝Aluminum–oxide铝氧化物Aluminumpassivation铝钝化Ambipolar双极的Ambienttemperature环境温度Amorphous无定形的，非晶体的Amplifier功放扩音器放大器Analogue(Analog)comparator模拟比较器Angstrom埃Anneal退火Anisotropic各向异性的Anode阳极Arsenic(AS)...
