题目基于单片机的温控风扇设计摘要现代社会中，众多的工业生产、日常生活都离不开温控风扇的应用，其在工程建设的散热系统、手提电脑处理器降温等有着突出的作用。本研究对温控风扇系统进行分析设计，单片机为其核心构成部分，通过温度传感器DS18B20获取温度信息，输入至单片机内部，单片机与系统设置的温度做比较，发出相应的控制信号，通过ULN2803控制风扇系统对元件进行散热处理，同时能通过判断设定温度与采集温度的温差大小，来确定风扇系统的转速，采用LED八段数码管实现温度显示功能。动态显示当前所处的环境温度和设定温度，并可以通过键盘按钮设定当前温度。键盘部位则可以自主调节设定温度而DS18B20可以测定外部环境温度，然后记录环境温度和设定温度并将其连续及时显示。关键词：单片机、DS18B20、温控、LED·IAbstractInmodernsociety,manyindustrialproductionanddailylifeareinseparablefromtheapplicationoftemperaturecontrolfan,whichplaysaprominentroleinthecoolingsystemofengineeringconstructionandthecoolingofportablecomputerprocessor.Inthisstudy,thetemperaturecontrolfansystemisanalyzedanddesigned.Thesingle-chipmicrocomputeristhecorecomponent.ThetemperatureinformationisobtainedbythetemperaturesensorDS18B20andinputtothesingle-chipmicrocomputer.Thesingle-chipmicrocomputercompareswiththetemperaturesetbythesystemandsendsoutthecorrespondingcontrolsignal.ThecomponentsarecooledbytheULN2803controlfansystem,Atthesametime,thespeedofthefansystemcanbedeterminedbyjudgingthetemperaturedifferencebetweenthesettemperatureandthecollectedtemperature,andtheLEDeightsegmentnixietubeisusedtorealizethetemperaturedisplayfunction.Dynamicdisplayofthecurrentenvironmenttemperatureandsettemperature,andthroughthekeyboardbuttontosetthecurrenttemperature.Thekeyboardpartcanadjustthesettingtemperatureindependently,andtheDS18B20canmeasuretheexternalenvironmenttemperature,thenrecordtheenvironmenttemperatureandsettingtemperature,anddisplaythemcontinuouslyandtimely.Keywords:MCU,DS18B20,temperaturecontrol,LED·II目录摘要······················································································································IAbstract·····················································································································II第一章整体方案设计···················································································11.1前言·····························································································11.2系统整体设计····················································································11.3方案论证··························································································21.3.1温度传感器的选择······································································21.3.2控制核心的选择··························...
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