DKBA华为技术有限公司企业技术标准DKBA3178.1-2006.07代替Q/DKBA3178.1-2004刚性PCB检验标准2006年06月29日发布2006年07月01日实施华为技术有限公司HuaweiTechnologiesCo.,Ltd.版权所有侵权必究Allrightsreserved目次前言..................................................................101范围....................................................................121.1范围..............................................................121.2简介..............................................................121.3关键词............................................................122规范性引用文件..........................................................123术语和定义..............................................................124文件优先顺序............................................................135材料品质................................................................145.1板材..............................................................145.2介质厚度公差......................................................145.3金属箔............................................................145.4镀层..............................................................145.5阻焊膜（SolderMask）.............................................155.6标记油墨..........................................................155.7最终表面处理......................................................156外观特性................................................................156.1板边..............................................................156.1.1毛刺/毛头（burrs)..........................................156.1.2缺口/晕圈（nicks/haloing）.................................166.1.3板角/板边损伤..............................................166.2板面..............................................................166.2.1板面污渍...................................................166.2.2水渍.......................................................176.2.3异物（非导体）.............................................176.2.4锡渣残留...................................................176.2.5板面余铜...................................................176.2.6划伤/擦花（Scratch）.......................................176.2.7压痕.......................................................176.2.8凹坑(PitsandVoids).......................................176.2.9露织物/显布纹(WeaveExposure/WeaveTexture）...............186.3次板面............................................................186.3.1白斑/微裂纹(Measling/Crazing)..............................186.3.2分层/起泡(Delamination/Blister)............................196.3.3外来夹杂物(ForeignInclusions).............................206.3.4内层棕化或黑化层擦伤.......................................206.4导线..............................................................206.4.1缺口/空洞/针孔.............................................206.4.2镀层缺损...................................................206.4.3开路/短路..................................................216.4.4导线压痕...................................................216.4.5导线露铜...................................................216.4.6铜箔浮离...................................................216.4.7补线.......................................................216.4.8导线粗糙...................................................226.4.9导线宽度.........................
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