目录摘要.........................................................................................................................................................ii第一章绪论.................................................................................................................................................11.1课题开发背景.................................................................................................................................11.1.1选题背景............................................................................................................................11.2研究现状及发展趋势....................................................................................................................1第二章柔性电路板...................................................................................................................................3概述...............................................................................................................................................32．1柔性电路板的结构...............................................................................................................42.2FPC的种类...........................................................................................................................42.3FPC柔性电路板的特点.......................................................................................................5第三章FPC生产线工艺流程.......................................................................................................................73.1概述...............................................................................................................................................73.2生产线的工艺流程........................................................................................................................73.3FPC生产线工艺流程各个工序.....................................................................................................73.3.1开料...................................................................................................................................73.3.2钻孔.....................................................................................................................................73.3.3PTH.....................................................................................................................................83.3.4曝光...................................................................................................................................93.3.5蚀刻...................................................................................................................................103.3.6线路...................................................................................................................................113.3.7贴Coverlay......................................................................................................................113.3.8压合...................................................................................................................................123.3.9印刷文字...........................................................................................................................123.3.10镀锡...............................................................
