中文摘要题目： SMT 无铅回流焊接技术的应用 摘要：随着人们环保思想的深入，人们越来越关心重视绿色无毒的生产技术在电子行业的使用已经是大势所趋。又随着ROHS（Restriction of Hazardous Substances）的出台实施，已经严格限制在电子电器设备中使用某些有害成分，其中铅的含量更被限制不得超过0.1%，这时候对无铅技术的分析和讨论是有必要的。无铅技术包括相应的组装方式，无铅回流焊接工艺是如今表面组装技术中最重要的工艺之一。在材料上，尤其是焊料上变化最大，无铅焊料与有铅焊料的不同迫使回流焊接设备和工艺也要做出相应的调整，自然而然焊接质量将出现新的问题。对无铅回流焊接的充分分析，对其产生的缺陷给出合适的解决方法等，是我们探讨的重点。关键词：无铅 回流焊接 缺陷 解决方法毕业设计(论文)外文摘要Title : A pplications of Lead-free Reflow Soldering in SMT and Solutions of its Defects Abstract: With the deepening of people's environmental protection, people pay more and more attention to the importance of green non-toxic production technology in the electronics industry is the trend. With ROHS (Restriction of Hazardous Substances) the introduction of the implementation, has strict restrictions on the use of certain hazardous substances in electrical and electronic equipment in the lead content is limited shall not exceed 0.1%, then analysis and Discussion on lead-free technology is necessary. Lead free technology, including the corresponding assembly methods, lead-free reflow soldering process is now one of the most important surface assembly process. In the material, especially the largest change in solder, lead-free solder and lead solder has forced the reflow soldering equipment and processes to be adjusted accordingly, the quality of the welding will be a new problem. The full analysis of lead-free reflow soldering and the proper solution to the defects are the focus of our study. keywords: lead-free reflow soldering de...
