目录中文摘要.....................................................................................................................................IAbstract......................................................................................................................................II第一章 绪论...............................................................................................................................11.1 论文研究的背景及意义................................................................................................11.2 国内外研究现状............................................................................................................21.3 研究内容和指标............................................................................................................21.4 本文主要框架与结构....................................................................................................3第二章 智能高功率模块封装特性研究...................................................................................52.1 智能高功率模块三维结构特性....................................................................................52.2 智能高功率模块热学特性............................................................................................72.3 IGBT 智能高功率模块的电气特性..............................................................................82.5 本章小结......................................................................................................................11第三章 智能高功率模块键合引线寄生参数研究.................................................................123.1 智能高功率模块电感理论..........................................................................................123.2 智能高功率模块版图..................................................................................................143.3 智能高功率模块寄生参数仿真模型..........................................................................163....
