SurfaceMountTechnologyIntroduction表面贴装技术简介Definition/定义2➢SMT-SurfaceMountingTechnology:SMTisaprocessorassemblytechniquebywhichcomponentsaresolderedontotheboardsurface./SMT是把零件焊接到印刷线路板表面的工艺或装配技术.LearningObjective3➢》GeneralProcessEngineeringIntroduction/一般的工艺流程介绍➢》SMTvsTHT/表面贴装技术vs通孔装配技术➢Composition/组成➢AssemblyClassifications/装配分类➢Advantages/优点➢DevelopmentTrend/发展趋势➢SMTdefect&Countermeasure/SMT不良及改善对策》Processflow/工艺流程图4PrintingPasteInspectionPlacementReflowsolderClearingPCBFAFunctionTestPackingFQAInspectionShippingOKNGVisualInspectionICTTESTPCBAFUNCTIONTESTBoxBuildingReworkNGNGOKOKNGOKVisualInspectionAOTtestHandloadingWavesolderOKReworkOKNGNGOKPCBAProcessFlowChart/SMT工艺流程图SMTEquipmentOverview/SMT设备纵览5SurfaceMountingTechnologyPrinterP&PP&PReflowOvenAOIQualitycontrolpointQualitycontrolpointProcessFlow/工艺流程FlowChartGenericProcessFlow/一般的工艺流程图ProcessDescription:过程描述KeyParameter:关键参数Responsibility:责任ReceivingMaterial/收料PartNumberandQuantityStoreProcessDescription:过程描述KeyParameter:关键参数Responsibility:责任IncomingInspection/来料检查InspectiononIncomingIQC6ProcessFlow/工艺流程FlowChartGenericProcessFlow/一般的工艺流程图ProcessDescription:过程描述KeyParameter:关键参数Responsibility:责任StorageandMaterialKiting/物料存放PartNumber,WorkOrderQuantity,FIFO,WIPStoresProcessDescription:LabelApplicationandboardtracking/贴标签板的跟踪过程描述KeyParameter:关键参数Responsibility:责任LabelVerificationandCorrectKitReleaseonNetworkMBU/制造部门7ProcessFlow/工艺流程FlowChartGenericProcessFlow/一般的工艺流程图ProcessDescription:过程描述KeyParameter:ScreenPrinting/丝印Stencilselection,Supportingjig,PasteHeight,MachineParameters,Stencilcleaning,SolderPasteUsabilityResponsibility:IPQC,Eng.,MBU,StoresProcessDescription:过程描述KeyParameter:关键参数Responsibility:责任PickandPlace(surfacemounting)表面贴装BOM,LoadingList,LayoutQA,Eng.,MBU制造部8ProcessFlow/工艺流程FlowChartGenericProcessFlow/一般的工艺流程图ProcessDescription:过程描述KeyParameter:关键参数Responsibility:责任Reflow/回流TemperatureProfiletoMatchSpecificProductEng.ProcessDescription:PostReflowInspection/回流后检查过程描述KeyParameter:关键参数Responsibility:IPC-A-610,CustomerBOMMBU9ProcessFlow/工艺流程FlowChartGenericProcessFlow/一般的工艺流程图ProcessDescription:过程描述KeyParameter:HandInsertion（PTH)/手插件HandInsertionofComponentsasperinstruction/layout关键参数Responsibility:责任MBUProcessDescription:过程描述KeyParameter:Wavesoldering/波峰焊接TemperatureProfile,Flux,Solderbar,Wavepallet,关键参数Responsibility:责任Eng.10ProcessFlow/工艺流程GenericProcessFlow/一般的工艺流程图ProcessDescription:过程描述KeyParameter:关键参数Responsibility:责任De-panelizeofPCB/分板TabRemovalandPCBDe-panelizeMBUProcessDescription:VisualInspectionandDateCollection/目检和系统跟踪过程描述KeyParameter:关键参数Responsibility:责任IPC-A-610D,layoutMBU11ProcessFlow/工艺流程FlowChartGenericProcessFlow/一般的工艺流程图ProcessDescription:过程描述KeyParameter:关键参数Responsibility:责任Screwing/打螺丝Torque/screwtipMBU/Eng.ProcessDescription:过程描述KeyParameter:关键参数Responsibility:责任InCircuitTest/在路测试TestPCBAssemblyCircuitry/测试PCB装配线路MBU12ProcessFlow/工艺流程FlowChartGenericProcessFlow/一般的工艺流程图ProcessDescription:过程描述Key...
